The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Sep. 26, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Krishna Vasanth Valavala, Chandler, AZ (US);
Kelly Lofgreen, Phoenix, AZ (US);
Chandra-Mohan Jha, Tempe, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/38 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/38 (2013.01); H01L 21/4882 (2013.01); H01L 23/3675 (2013.01); H01L 25/0655 (2013.01);
Abstract
Embodiments herein relate to systems, apparatuses, processing, and techniques related to a first heat-conducting plate to be thermally coupled to a first heat source, a thermoelectric cooler (TEC) thermally coupled to the first plate, a second heat-conducting plate thermally coupled to the TEC and to be thermally coupled to a second heat source where the TEC is to at least partially thermally isolate the first plate from the second plate to reduce heat transfer from the first plate to the second plate.