The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Feb. 23, 2018
Mitsubishi Materials Corporation, Tokyo, JP;
Ryohei Yumoto, Saitama, JP;
Sotaro Oi, Saitama, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A power-module substrate and a heat sink made of an aluminum-impregnated silicon carbide formed by impregnating aluminum in a porous body made of silicon carbide; where yield strength of a circuit layer is σ(MPa), a thickness of the circuit layer is t(mm), a bonding area of the circuit layer and a ceramic board is A(mm), yield strength of a metal layer is σ(MPa), a thickness of the metal layer is t(mm), a bonding area of the metal layer and the ceramic board is A(mm); the thickness tis formed to be between 0.1 mm and 3.0 mm (inclusive); the thickness tis formed to be between 0.15 mm and 5.0 mm (inclusive); the thickness tis formed larger than the thickness t; and a ratio {(σ×t×A)/(σ×t×A)} is in a range between 1.5 and 15 (inclusive).