The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Dec. 26, 2018
Applicant:
Nissan Motor Co., Ltd., Yokohama, JP;
Inventors:
Hiroshi Sato, Ibaraki, JP;
Yoshinori Murakami, Kanagawa, JP;
Hidekazu Tanisawa, Ibaraki, JP;
Shinji Sato, Ibaraki, JP;
Fumiki Kato, Ibaraki, JP;
Kazuhiro Mitamura, Ibaraki, JP;
Yui Takahashi, Tokyo, JP;
Assignee:
NISSAN MOTOR CO., LTD., Yokohama, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/62 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device includes a semiconductor chip provided inside with a p-n junction, an opaque sealing resin covering a surface of the semiconductor chip, and a functional region arranged between the semiconductor chip and the sealing resin and configured to prevent light, which is generated when a forward current flows through the p-n junction and has a particular wavelength causing deterioration of the sealing resin, from reaching the sealing resin.