The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Oct. 06, 2020
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Hironari Ohkubo, Tokyo, JP;

Keita Obara, Tokyo, JP;

Shinya Honda, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/268 (2006.01); H01L 21/66 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01); H01L 21/78 (2006.01); G06T 7/73 (2017.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); G06T 7/001 (2013.01); G06T 7/74 (2017.01); H01L 21/268 (2013.01); H01L 22/20 (2013.01); H01L 23/544 (2013.01); G06T 2207/30148 (2013.01); H01L 2223/5446 (2013.01);
Abstract

A wafer processing method includes a pattern region detecting step, an evaluation region setting step, and an evaluation region deploying step. The pattern region detecting step is a step of detecting a period and positional information in which a substantially identical image appears in an imaged image and detecting a pattern region corresponding to one period. The evaluation region setting step is a step of detecting a position in which no metallic pattern is formed on planned dividing lines and setting the position as an evaluation region for evaluating quality of a processed groove. The evaluation region deploying step is a step of recording the position of the evaluation region in the pattern region and deploying the evaluation region at similar positions in different pattern regions.


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