The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Jun. 22, 2020
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Jung-Chan Yang, Longtan Township, TW;
Ting-Wei Chiang, New Taipei, TW;
Jerry Chang-Jui Kao, Taipei, TW;
Hui-Zhong Zhuang, Kaohsiung, TW;
Lee-Chung Lu, Taipei, TW;
Li-Chun Tien, Tainan, TW;
Meng-Hung Shen, Zhubei, TW;
Shang-Chih Hsieh, Yangmei, TW;
Chi-Yu Lu, New Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
An integrated circuit structure includes a first, a second and a third set of conductive structures and a first and a second set of vias. The first set of conductive structures extend in a first direction, and is located at a first level. The second set of conductive structures extends in a second direction, overlaps the first set of conductive structures, and is located at a second level. The first set of vias is between, and electrically couples the first and the second set of conductive structures. The third set of conductive structures extends in the first direction, overlaps the second set of conductive structures, covers a portion of the first set of conductive structures, and is located at a third level. The second set of vias is between, and electrically couples the second and the third set of conductive structures.