The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2022

Filed:

Aug. 29, 2016
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Yasuyuki Hoshi, Matsumoto, JP;

Yuichi Harada, Matsumoto, JP;

Takashi Shiigi, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/45 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/417 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 29/41741 (2013.01); H01L 29/45 (2013.01); H01L 29/66068 (2013.01); H01L 29/7802 (2013.01); H01L 23/564 (2013.01);
Abstract

A semiconductor device, including a substrate, and a deposit layer and a semiconductor layer formed sequentially on the substrate. The semiconductor layer has selectively disposed therein a first region, a second region and a contact region. A gate electrode is disposed on the first region and the semiconductor layer via a gate insulating film. A source electrode is formed in contact with the contact region and the second region. A drain electrode is disposed on the back surface of the substrate. The source electrode has a first titanium (Ti) film, and a titanium nitride (TiN) film, a second Ti film, and a metal film containing aluminum (Al) sequentially formed on the first Ti film. The source electrode may further include another TiN film, on which the first Ti film is formed.


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