The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2022
Filed:
Jun. 19, 2020
Applicant:
United Microelectronics Corp., Hsinchu, TW;
Inventors:
Assignee:
UNITED MICROELECTRONICS CORP., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 22/30 (2013.01);
Abstract
A method for measuring chips bonding strength includes steps as follows: An auxiliary pattern is formed on a first surface of a first chip. A second surface of a second chip is bonded to the first surface to form at least one gap space surrounding the auxiliary pattern. Next, dimensions of the at least one gap space and the auxiliary pattern are measure respectively; and the bonding strength between the first chip and the second chip is estimated according to the dimensions.