The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2022
Filed:
Jun. 19, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Yan-Hong Liu, Hsinchu, TW;
Che-Fu Chen, Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd, Hsinchu, TW;
Abstract
The present disclosure describes a method that prevents pre-mature de-chucking in processing modules. The method includes placing a wafer onto a chuck equipped with lift pins. One or more of the lift pins include a pressure sensor configured to measure a pressure exerted by the wafer. The method further includes measuring a first pressure applied to the one or more lift pins by the wafer, lowering the lift pins to place the wafer on the chuck, and processing the wafer. The method also includes removing the wafer from the chuck by pressing the one or more lift pins against the wafer to measure a second pressure exerted by the wafer. If the measured second pressure is equal to the first pressure, the method raises the wafer using the lift pins above the chuck.