The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2022

Filed:

Aug. 25, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Hiroshi Yamada, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/02 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/20 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2887 (2013.01); G01R 1/07342 (2013.01); G01R 31/2891 (2013.01);
Abstract

A wafer inspection deviceis provided with a chuck topon which a wafer W having semiconductor devices formed thereon is placed, a probe cardhaving multiple contact probesprotruding toward the wafer W, a pogo framefor holding the probe card, a cylindrical internal bellowsconfigured to suspend from the pogo frameto surround the contact probes, and a cylindrical external bellowsconfigured to suspend from the pogo frameto surround the internal bellows. When the chuck topapproaches the probe cardand the contact probesare brought into contact with the devices, the internal bellowsand the external bellowscome in contact with the chuck top, a sealing space P is formed between the internal bellowsand the external bellows, and the sealing space P is compressed.


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