The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Feb. 12, 2021
Changxin Memory Technologies, Inc., Anhui, CN;
Chia-Chi Hsu, Hefei, CN;
Changxin Memory Technologies, Inc., Hefei, CN;
Abstract
The embodiments of the present invention discloses an arrangement of bond pads on an integrated circuit chip. The integrated circuit chip includes: a first row of bond pads; and a second row of bond pads, wherein bond pads in the first row are positioned alternately with bond pads in the second row, and a short side of the bond pads in the first row and the second row is parallel to a long side of the integrated circuit chip. With this arrangement of bond pads on the integrated circuit chip, the bond pads may occupy a reduced area of a surface of the integrated circuit chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile