The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Dec. 27, 2019
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Ying-Chih Hsu, Hsinchu, TW;
Wen-Shiang Liao, Miaoli County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a semiconductor substrate, an interconnect structure, and a permalloy device. The interconnect structure is disposed over the semiconductor substrate. The interconnect structure includes a conductive coil. The conductive coil includes horizontally-extending metal lines, and vertically-extending vias electrically connecting the metal lines. The permalloy device is disposed in the interconnector structure and wound around by the conductive coil and insulated by the conductive coil, wherein the permalloy device and the conductive coil in combination define an inductor, and the permalloy device serves as a magnetic core of the inductor.