The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Mar. 03, 2021
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Marco Gavagnin, Leoben, AT;

Gerald Weis, Bruck an der Mur, AT;

Markus Leitgeb, Trofaiach, AT;

Gernot Grober, Weißkirchen, AT;

Young Hy Jung, Leoben, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 25/065 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/5329 (2013.01); H01L 23/53209 (2013.01); H01L 21/76898 (2013.01); H01L 23/13 (2013.01); H01L 23/49827 (2013.01); H01L 25/0655 (2013.01);
Abstract

An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged.


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