The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Jun. 17, 2019
Applicant:

Shennan Circuits Co., Ltd., Shenzhen, CN;

Inventors:

Beilei Wang, Shenzhen, CN;

Weijing Guo, Shenzhen, CN;

Yuhua Zeng, Shenzhen, CN;

Hua Miao, Shenzhen, CN;

Zhanhao Xie, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/24 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H01F 27/28 (2006.01); H05K 1/02 (2006.01); H01F 41/04 (2006.01); H05K 1/16 (2006.01); H05K 3/06 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/24 (2013.01); H01F 41/041 (2013.01); H05K 1/024 (2013.01); H05K 1/115 (2013.01); H05K 1/165 (2013.01); H05K 3/06 (2013.01); H05K 3/424 (2013.01); H01F 2027/2809 (2013.01); H05K 2203/0723 (2013.01);
Abstract

An electromagnetic device and a method for manufacturing the same are disclosed. The electromagnetic device includes a base plate, a magnetic core, multiple transmission units, and connection layers. The base plate includes a central part defining multiple inner via holes and a peripheral part defining multiple outer via holes. An annular accommodating groove is defined between the central part and the peripheral part. The magnetic core is received in the annular accommodating groove. Transmission units are located on both sides of the base plate. Each transmission unit includes a transmission wire layer including multiple conductive wire patterns, and each conductive wire pattern bridges one inner via hole and one outer via hole. Each of the connection layers is set on one side of the transmission wire layer close to the base plate. At least one connection layer has a dielectric loss no larger than 0.02.


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