The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Feb. 13, 2019
Mitsubishi Electric Corporation, Tokyo, JP;
Yoshiko Fujima, Tokyo, JP;
Toshiki Asai, Tokyo, JP;
Yusuke Morimoto, Tokyo, JP;
Kohei Sato, Tokyo, JP;
Shunsuke Sasaki, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate () having a mounting hole () that penetrates through the first insulating substrate () from a first surface () to a second surface (); a second insulating substrate () including a connection portion () that penetrates through the mounting hole () from the first surface () side and protrudes from the second surface (); first electrodes (and) that are provided on the second surface () and are arranged at an edge of the mounting hole (); and second electrodes (and) provided on the connection portion (). The first electrodes (and) and the second electrodes (and) are joined by solder. The printed circuit board further includes a coating film () that is disposed at least on a front end side of the connection portion () than a portion where the second electrodes (and) are joined to the first electrodes (and) by the solder.