The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Oct. 19, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Karthik Chandrasekar, San Jose, CA (US);
Guang Chen, San Jose, CA (US);
Wendemagegnehu T. Beyene, San Jose, CA (US);
Ravi Prakash Gutala, San Jose, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 19/17772 (2020.01); H01L 25/18 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); G06F 30/34 (2020.01); H02M 3/04 (2006.01); H02M 3/156 (2006.01);
U.S. Cl.
CPC ...
H03K 19/17772 (2013.01); G06F 30/34 (2020.01); H01L 23/5381 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/18 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17181 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1435 (2013.01); H02M 3/04 (2013.01); H02M 3/156 (2013.01);
Abstract
A device may include a fabric die coupled to an active interposer. The fabric die may include programmable logic fabric and configuration memory that programs the programmable logic fabric. The programmable logic fabric of the fabric die may access at least a portion of the active interposer to perform an operation. As discussed herein, different power management techniques associated with the active interposer may be used to improve operation of the device.