The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Jul. 20, 2020
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Wei Chih Cho, Kaohsiung, TW;

Chun Chen Chen, Kaohsiung, TW;

Shao-Lun Yang, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 21/56 (2013.01); H01L 23/3185 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/17181 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06582 (2013.01);
Abstract

A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a first substrate, a second substrate, and a barrier structure. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface facing the second surface of the first substrate. The first substrate electrically bonds to the second substrate through a conductive terminal disposed between the second surface of the first substrate and the first surface of the second substrate. The barrier structure is disposed adjacent to the first surface of the first substrate.


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