The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Apr. 27, 2020
Applicant:
Siliconwar E PR Ecision Industries Co., LT D., Taichung, TW;
Inventors:
Jin-Wei You, Taichung, TW;
Cheng-Kai Chang, Taichung, TW;
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 33/54 (2010.01); H01L 33/64 (2010.01); H01L 23/00 (2006.01); H01S 5/026 (2006.01); H01L 23/552 (2006.01); H01L 25/03 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01S 5/024 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/31 (2013.01); H01L 33/54 (2013.01); H01L 33/64 (2013.01); H01S 5/026 (2013.01);
Abstract
The present application provides an electronic package having an optoelectronic component and a laser component disposed on a packaging unit, with the optoelectronic component and the laser component being separated from each other. Since the laser component and the optoelectronic component are separated from each other, the electronic package has a reduced fabrication difficulty and a high yield rate. A method for fabricating the electronic package and an electronic packaging module having the electronic package are also provided.