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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11443964 B1

PDFFull Text
Date of Patent:
Sep. 13, 2022

Filed:

Nov. 01, 2016

Substrate processing apparatus and substrate processing system

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masatoshi Kaneda, Koshi, JP;

Yuzo Ohishi, Koshi, JP;

Keisuke Yoshida, Koshi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Peame & Gordon LLP

Primary Examiner:

Karla A Moore

Assistant Examiner:

Tiffany Z Nuckols

Int. Cl.
CPC ...
H01L 21/67 (2006.01); B05C 11/08 (2006.01); B05C 11/10 (2006.01); H01L 21/311 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67069 (2013.01); B05C 11/08 (2013.01); B05C 11/1002 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/311 (2013.01); H01L 21/31058 (2013.01); H01L 21/31138 (2013.01); H01L 21/6715 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/67748 (2013.01); H01L 21/67751 (2013.01); H01L 21/68742 (2013.01); H01L 21/31144 (2013.01);
Abstract

A substrate processing apparatus includes a placing table configured to hold a substrate having a processing target film, which is decomposed by irradiating an ultraviolet ray thereto under an oxygen-containing atmosphere; a processing chamber, configured to accommodate therein the substrate placed on the placing table, having therein the oxygen-containing atmosphere; and an ultraviolet ray irradiation device configured to irradiate the ultraviolet ray to the substrate within the processing chamber. Further, the placing table is provided with a surrounding member configured to surround the substrate placed on the placing table and restrict a gas introduction amount from an outside of the substrate toward above the substrate.

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