The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Jan. 03, 2019
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Kenichi Kobayashi, Tokyo, JP;

Tetsuji Togawa, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 57/02 (2006.01); B24B 53/017 (2012.01); B24B 37/04 (2012.01); B24B 37/26 (2012.01);
U.S. Cl.
CPC ...
B24B 57/02 (2013.01); B24B 37/042 (2013.01); B24B 53/017 (2013.01); B24B 37/26 (2013.01);
Abstract

A polishing liquid is supplied without passing through a rotary joint in a face-up type polishing apparatus. This application discloses a polishing head for the face-up type polishing apparatus used by mounting a polishing pad on a lower surface as one embodiment. The polishing head includes a liquid reservoir portion that receives a liquid and a liquid discharge port that discharges the liquid received by the liquid reservoir portion. The liquid reservoir portion is disposed around a rotation axis of the polishing head. The liquid discharge port is disposed on the lower surface of the polishing head. An annular opening centering on the rotation axis of the polishing head is formed on an upper portion of the polishing head. The liquid reservoir portion is communicated with a space outside the polishing head via the opening.


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