The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Jan. 06, 2020
Applicant:
Sony Group Corporation, Tokyo, JP;
Inventors:
Joseph M. Steigerwald, Forest Grove, OR (US);
Tahir Ghani, Portland, OR (US);
Jenny Hu, Hillsboro, OR (US);
Ian R. C. Post, Portland, OR (US);
Assignee:
Sony Group Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/786 (2006.01); H01L 29/51 (2006.01); H01L 27/088 (2006.01); H01L 21/28 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7831 (2013.01); H01L 21/28114 (2013.01); H01L 21/82345 (2013.01); H01L 21/823431 (2013.01); H01L 21/823456 (2013.01); H01L 27/0886 (2013.01); H01L 29/42372 (2013.01); H01L 29/4908 (2013.01); H01L 29/4958 (2013.01); H01L 29/4966 (2013.01); H01L 29/517 (2013.01); H01L 29/66484 (2013.01); H01L 29/66772 (2013.01); H01L 29/66795 (2013.01); H01L 29/7855 (2013.01); H01L 29/7856 (2013.01); H01L 29/78645 (2013.01); H01L 29/42376 (2013.01);
Abstract
Embodiments of the present disclosure describe multi-threshold voltage devices and associated techniques and configurations. In one embodiment, an apparatus includes a semiconductor substrate, a channel body disposed on the semiconductor substrate, a first gate electrode having a first thickness coupled with the channel body and a second gate electrode having a second thickness coupled with the channel body, wherein the first thickness is greater than the second thickness. Other embodiments may be described and/or claimed.