The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Jul. 02, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Michael J. Hill, Gilbert, AZ (US);
Leigh E. Wojewoda, Tempe, AZ (US);
Mathew Manusharow, Phoenix, AZ (US);
Siddharth Kulasekaran, Tempe, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/34 (2006.01); H01L 25/065 (2006.01); H01L 49/02 (2006.01); H01F 27/08 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01F 27/085 (2013.01); H01L 23/34 (2013.01); H01L 23/645 (2013.01); H01L 28/10 (2013.01);
Abstract
Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein the inductor is at least partially embedded within the substrate. One or more thermal vent structures extend through at least one of the substrate or a board attached to the substrate. The one or more thermal vent structures provide a thermal pathway for cooling for the inductor.