The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Oct. 17, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chih-Fan Huang, Kaohsiung, TW;
Mao-Nan Wang, Kaohsiung, TW;
Hui-Chi Chen, Zhudong Township, Hsinchu County, TW;
Dian-Hau Chen, Hsinchu, TW;
Yen-Ming Chen, Chu-Pei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A chip structure is provided. The chip structure includes a semiconductor substrate. The chip structure includes a first dielectric layer over the semiconductor substrate. The chip structure includes a first conductive layer over the first dielectric layer. The chip structure includes a second dielectric layer over the first conductive layer and the first dielectric layer. The chip structure includes a first conductive via passing through the second dielectric layer, the first conductive layer, and the first dielectric layer and electrically connected to the first conductive layer. The chip structure includes a second conductive via passing through the second dielectric layer and the first dielectric layer. The chip structure includes a first conductive pad over and in direct contact with the first conductive via. The chip structure includes a second conductive pad over and in direct contact with the second conductive via.