The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Jul. 06, 2020
Applicant:

X-fab Semiconductor Foundries Gmbh, Erfurt, DE;

Inventor:

Ralf Lerner, Erfurt, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/66 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 22/20 (2013.01); H01L 25/16 (2013.01); H01L 25/167 (2013.01); H01L 2221/68363 (2013.01);
Abstract

Methods for mounting devices on a non-native substrate by a transfer stamp are disclosed. A method may include providing () a first semiconductor wafer () comprising mostly functional first devices () and a few non-functional first devices () in a first grid pattern (x, y); providing () a second semiconductor wafer () comprising second devices () in a second grid pattern (x', y′); removing () the non-functional first devices () from the first semiconductor wafer () in respective individual first transfer printing steps; transferring () a plurality of the functional first devices () from the first semiconductor wafer () to the associated second devices () of the second semiconductor wafer () in a second transfer printing step; and transferring () individual functional first devices () of the first semiconductor wafer () to second devices not having first devices printed thereon () in respective individual third transfer printing steps.


Find Patent Forward Citations

Loading…