The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Jul. 20, 2020
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a conductive base, a first semiconductor die, a first conductive pillar, and a first encapsulant. The conductive base has a first surface. The first semiconductor die is disposed on the first surface of the conductive base. The first conductive pillar is disposed on the first semiconductor die. The first encapsulant is disposed on the first surface of the conductive base. The first encapsulant encapsulates the first semiconductor die. The first encapsulant includes an opening defined by the first conductive pillar.