The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Feb. 21, 2018
Mitsubishi Materials Corporation, Tokyo, JP;
Keiichiro Oishi, Osaka, JP;
Kouichi Suzaki, Osaka, JP;
Shinji Tanaka, Osaka, JP;
Takayuki Oka, Osaka, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
This free-cutting copper alloy comprises 75.4-78.7% Cu, 3.05-3.65% Si, 0.10-0.28% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 76.5≤f1=Cu+0.8×Si−8.5×Sn+P≤80.3; 60.7≤f2=Cu−4.6×Si−0.7×Sn−P≤62.1; and 0.25≤f7=P/Sn≤1.0. The area percentage (%) of respective constituent phases satisfies the following relations: 28≤κ≤67; 0≤γ≤1.0; 0≤β≤0.2; 0≤μ≤1.5; 97.4≤f3=α+κ; 99.4≤f4=α+κ+γ+μ; 0≤f5=γ+μ≤2.0; and 30≤f6=κ+6×γ+0.5×μ≤70. The long side of the γ phase is at most 40 μm, the long side of the μ phase is at most 25 μm, and κ phase is present in α phase.