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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11430914 B1

PDFFull Text
Date of Patent:
Aug. 30, 2022

Filed:

Dec. 26, 2019

Semiconductor light emitting device and method of manufacturing semiconductor light emitting device

Applicant:

Nikkiso Co., Ltd., Tokyo, JP;

Inventors:

Noritaka Niwa, Hakusan, JP;

Tetsuhiko Inazu, Hakusan, JP;

Yasumasa Suzaki, Kawasaki, JP;

Akifumi Nawata, Kawasaki, JP;

Satoru Tanaka, Kawasaki, JP;

Assignee:

NIKKISO CO., LTD., Tokyo, JP;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Moin M Rahman

Assistant Examiner:

Mohammad A Rahman

Int. Cl.
CPC ...
H01L 33/22 (2010.01); H01L 33/12 (2010.01); H01L 33/32 (2010.01); H01L 33/06 (2010.01); H01L 33/00 (2010.01); H01L 33/14 (2010.01);
U.S. Cl.
CPC ...
H01L 33/22 (2013.01); H01L 33/007 (2013.01); H01L 33/12 (2013.01); H01L 33/325 (2013.01); H01L 33/06 (2013.01); H01L 33/145 (2013.01);
Abstract

A semiconductor light emitting device includes a light extraction layer having a light extraction surface. Multiple cone-shaped parts formed in an array are provided on the light extraction surface of the semiconductor light emitting device. A proportion of an area occupied by the multiple cone-shaped parts per a unit area of the light extraction surface is not less than 65% and not more than 95% in a plan view of the light extraction surface, and an aspect ratio h/p defined as a proportion of a height h of the cone-shaped part relative to a distance p between apexes of adjacent cone-shaped parts is not less than 0.3 and not more than 1.0.

Find Patent Forward Citations

Niwa, Noritaka. (2022). Semiconductor light emitting device and method of manufacturing semiconductor light emitting device (U.S. Patent No. 11430914). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11430914

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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