The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Nov. 12, 2020
Applicant:

Ningbo Semiconductor International Corporation, Ningbo, CN;

Inventors:

Da Chen, Ningbo, CN;

Mengbin Liu, Ningbo, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14621 (2013.01); H01L 27/14634 (2013.01); H01L 27/14685 (2013.01);
Abstract

An image capturing assembly includes an encapsulation layer, embedded with functional components. The top surface and bottom surface of the encapsulation layer expose the functional components. A through hole is formed in the encapsulation layer; and the functional components have soldering pads facing away from a bottom of the encapsulation layer. A photosensitive unit including a photosensitive chip and an optical filter is mounted on the photosensitive chip. The photosensitive chip is embedded in the through hole; the optical filter is outside the through hole; the top surface and bottom surface of the encapsulation layer expose the photosensitive chip; and the photosensitive chip includes soldering pads facing away from the bottom of the encapsulation layer. A redistribution layer structure is on the top side of the encapsulation layer and electrically connects the soldering pads of the photosensitive chip with the soldering pads of the functional components.


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