The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Nov. 19, 2020
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Jerome Teysseyre, Scottsdale, AZ (US);

Inpil Yoo, Unterhaching, DE;

JooYang Eom, Gimpo-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2006.01); H01L 23/367 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 23/3677 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01);
Abstract

According to an aspect, a power module package includes a plurality of power modules including a first power module and a second power module, a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module, and a module carrier coupled to the plurality of power modules, where the module carrier includes a first region defining a first heat-sink slot and a second region defining a second heat-sink slot. The first heat sink extends at least partially through the first heat-sink slot and the second heat sink extends at least partially through the second heat-sink slot. The power module package includes a housing coupled to the module carrier and a ring member located between the module carrier and the housing.


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