The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Oct. 13, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Eswaranand Venkatasubramanian, Santa Clara, CA (US);

Samuel E. Gottheim, Santa Clara, CA (US);

Pramit Manna, Sunnyvale, CA (US);

Abhijit Basu Mallick, Palo Alto, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02274 (2013.01); H01J 37/32082 (2013.01); H01J 37/32715 (2013.01); H01J 37/32816 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/02123 (2013.01); H01L 21/02126 (2013.01); H01L 21/02164 (2013.01); H01L 21/02167 (2013.01); H01L 21/02186 (2013.01); H01L 21/02205 (2013.01); H01L 21/02208 (2013.01); H01L 21/02211 (2013.01); H01L 21/31144 (2013.01); H01J 2237/332 (2013.01); H01L 21/6831 (2013.01);
Abstract

Techniques for deposition of high-density dielectric films for patterning applications are described. More particularly, a method of processing a substrate is provided. The method includes flowing a precursor-containing gas mixture into a processing volume of a processing chamber having a substrate positioned on an electrostatic chuck. The substrate is maintained at a pressure between about 0.1 mTorr and about 10 Torr. A plasma is generated at the substrate level by applying a first RF bias to the electrostatic chuck to deposit a dielectric film on the substrate. The dielectric film has a refractive index in a range of about 1.5 to about 3.


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