The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Sep. 29, 2020
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Takuji Yamamura, Osaka, JP;

Kenya Nishiguchi, Osaka, JP;

Kazuhide Sumiyoshi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/778 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); H01L 21/8234 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/022 (2013.01); C23C 16/345 (2013.01); C23C 16/40 (2013.01); H01L 21/823468 (2013.01); H01L 23/291 (2013.01); H01L 23/3171 (2013.01); H01L 29/512 (2013.01); H01L 29/518 (2013.01); H01L 29/6656 (2013.01); H01L 29/7786 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02269 (2013.01);
Abstract

A method of manufacturing a high electron mobility transistor in a furnace, the method including steps of: forming a first SiN film on a surface of a semiconductor stack consisting of a nitride semiconductor and including a barrier layer by a low pressure chemical vapor deposition method at a first furnace temperature of 700° C. or more and 900° C. or less; forming an interface oxide layer on the first SiN film by moisture and oxygen in the furnace at a second furnace temperature of 700° C. or more and 900° C. or less and a furnace pressure to 1 Pa or lower; and forming a second SiN film on the interface oxide layer by the low pressure chemical vapor deposition method at a third furnace temperature of 700° C. or more and 900° C. or less.


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