The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Mar. 26, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Wonji Park, Suwon-si, KR;
Jeonghoon Ahn, Seongnam-si, KR;
Jihyung Kim, Seoul, KR;
Jaehee Oh, Seongnam-si, KR;
Yunki Choi, Yongin-si, KR;
Minguk Kang, Busan, KR;
Abstract
A method of estimating warpage of an interposer and a method of manufacturing a semiconductor package by using the same are disclosed. The interposer includes a through electrode passing through a substrate, and a plurality of metal wiring layers and a plurality of insulating layers on the substrate, and the method of estimating warpage of an interposer includes: performing a temperature sweep test by using sample interposers, and measuring warpages according to temperatures; deriving a warpage slope, as a function of temperature, of each of the sample interposers; deriving a warpage model by linearly fitting the warpage slope with respect to an average pattern density of metal wiring layers in each of the sample interposers; and calculating a room temperature warpage reference value of the interposer based on the warpage model.