The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Dec. 20, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Erkan Alpman, Portland, OR (US);

Arnaud Lucres Amadjikpe, Beaverton, OR (US);

Omer Asaf, M, IL;

Kameran Azadet, San Ramon, CA (US);

Rotem Banin, Even-Yehuda, IL;

Miroslav Baryakh, Petach Tikva, IL;

Anat Bazov, M, IL;

Stefano Brenna, Hillsboro, OR (US);

Bryan K. Casper, Portland, OR (US);

Anandaroop Chakrabarti, Hillsboro, OR (US);

Gregory Chance, Chandler, AZ (US);

Debabani Choudhury, Thousand Oaks, CA (US);

Emanuel Cohen, Z, IL;

Claudio Da Silva, San Jose, CA (US);

Sidharth Dalmia, Fair Oaks, CA (US);

Saeid Daneshgar Asl, Portland, OR (US);

Kaushik Dasgupta, Hillsboro, OR (US);

Kunal Datta, Los Angeles, CA (US);

Brandon Davis, Phoenix, AZ (US);

Ofir Degani, Haifa, IL;

Amr M. Fahim, Portland, OR (US);

Amit Freiman, Haifa, IL;

Michael Genossar, Modiin, IL;

Eran Gerson, Pardes Hana, IL;

Eyal Goldberger, Moshav Beherotaim, IL;

Eshel Gordon, Aloney Aba, IL;

Meir Gordon, Holon, IL;

Josef Hagn, Neubiberg, DE;

Shinwon Kang, San Francisco, CA (US);

Te Yu Kao, Milpitas, CA (US);

Noam Kogan, Tel-Aviv, IL;

Mikko S. Komulainen, Oulu, FI;

Igal Yehuda Kushnir, Hod-Hasharon, IL;

Saku Lahti, Tampere, FI;

Mikko M. Lampinen, Nokia, FI;

Naftali Landsberg, Ramat Gan, IL;

Wook Bong Lee, San Jose, CA (US);

Run Levinger, Tel Aviv, IL;

Albert Molina, Alcobendas, ES;

Resti Montoya Moreno, Helsinki, FI;

Tawfiq Musah, Hillsboro, OR (US);

Nathan G. Narevsky, Portland, OR (US);

Hosein Nikopour, San Jose, CA (US);

Oner Orhan, San Jose, CA (US);

Georgios Palaskas, Portland, OR (US);

Stefano Pellerano, Beaverton, OR (US);

Ron Pongratz, Tel Aviv, IL;

Ashoke Ravi, Portland, OR (US);

Shmuel Ravid, Haifa, IL;

Peter Andrew Sagazio, Portland, OR (US);

Eren Sasoglu, Mountain View, CA (US);

Lior Shakedd, Kfar Bilu, IL;

Gadi Shor, Tel Aviv, IL;

Baljit Singh, San Jose, CA (US);

Menashe Soffer, Katzir, IL;

Ra'anan Sover, Haifa, IL;

Shilpa Talwar, Cupertino, CA (US);

Nebil Tanzi, Hoffman Estates, IL (US);

Moshe Teplitsky, Tel-Aviv, IL;

Chintan S. Thakkar, Portland, OR (US);

Jayprakash Thakur, Bangalore, IN;

Avi Tsarfati, Rishon le Zion, IL;

Yossi Tsfati, Rishon le Zion, IL;

Marian Verhelst, Portland, OR (US);

Nir Weisman, Hod Hasharon, IL;

Shuhei Yamada, Hillsboro, OR (US);

Ana M. Yepes, Portland, OR (US);

Duncan Kitchin, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 5/47 (2015.01); H01Q 9/04 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 1/48 (2006.01); H01Q 3/24 (2006.01); H01Q 21/24 (2006.01); H03L 7/14 (2006.01); H04B 1/3827 (2015.01); H04B 7/0456 (2017.01); H04B 7/06 (2006.01); H04B 15/04 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0414 (2013.01); H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H01Q 3/24 (2013.01); H01Q 5/47 (2015.01); H01Q 21/24 (2013.01); H03L 7/145 (2013.01); H04B 1/3827 (2013.01); H04B 7/0482 (2013.01); H04B 7/0639 (2013.01); H04B 15/04 (2013.01);
Abstract

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.


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