The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Apr. 10, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Karthik Balakrishnan, Scarsdale, NY (US);

Bahman Hekmatshoartabari, White Plains, NY (US);

Alexander Reznicek, Troy, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 27/092 (2006.01); H01L 29/10 (2006.01); H01L 21/8238 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7827 (2013.01); H01L 21/823814 (2013.01); H01L 21/823828 (2013.01); H01L 21/823864 (2013.01); H01L 21/823871 (2013.01); H01L 21/823885 (2013.01); H01L 27/092 (2013.01); H01L 27/0922 (2013.01); H01L 29/0847 (2013.01); H01L 29/1037 (2013.01); H01L 29/41733 (2013.01); H01L 29/41741 (2013.01); H01L 29/66545 (2013.01); H01L 29/66553 (2013.01); H01L 29/66666 (2013.01); H01L 29/66742 (2013.01); H01L 29/66977 (2013.01); H01L 29/78618 (2013.01); H01L 29/78642 (2013.01);
Abstract

A first vertical T-FET has a source heavily doped with a source concentration of a source-type dopant, a drain doped with a drain concentration of a drain-type dopant, and a channel between the source and drain. The source, channel, and drain are stacked vertically in a fin or pillar perpendicular to a substrate. A gate stack encompasses the channel sides and has a drain overlap amount overlapping the drain sides and a source overlap amount overlapping the source sides. External contacts electrically connect the gate and source and/or drain. The source-type dopant and the drain-type dopant are opposite dopant types. In some embodiments, a second vertical T-FET is stacked on the first vertical T-FET. Different VT-FET devices are made by changing the materials, doping types and levels, and connections to the sources, channels, and drains. Device characteristics are designed/changed by changing the amount of source and drain overlaps of the gate stack(s).


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