The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Dec. 10, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Yun-Chi Wu, Tainan, TW;

Cheng-Bo Shu, Tainan, TW;

Chien Hung Liu, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/1157 (2017.01); H01L 29/66 (2006.01); H01L 27/11573 (2017.01); H01L 29/792 (2006.01); H01L 29/08 (2006.01); H01L 29/49 (2006.01); H01L 21/28 (2006.01); H01L 29/423 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1157 (2013.01); H01L 27/11573 (2013.01); H01L 29/0847 (2013.01); H01L 29/40117 (2019.08); H01L 29/42328 (2013.01); H01L 29/42364 (2013.01); H01L 29/495 (2013.01); H01L 29/4916 (2013.01); H01L 29/513 (2013.01); H01L 29/6656 (2013.01); H01L 29/6659 (2013.01); H01L 29/66545 (2013.01); H01L 29/66833 (2013.01); H01L 29/792 (2013.01); H01L 29/517 (2013.01); H01L 29/665 (2013.01);
Abstract

Various embodiments of the present application are directed to an integrated circuit (IC) comprising a memory cell with a large operation window and a high erase speed. In some embodiments, the IC comprises a semiconductor substrate and a memory cell. The memory cell comprises a control gate electrode, a select gate electrode, a charge trapping layer, and a common source/drain region. The common source/drain is defined by the semiconductor substrate and is n-type. The control gate electrode and the select gate electrode overlie the semiconductor substrate and are respectively on opposite sides of the common source/drain. Further, the control gate electrode overlies the charge trapping layer and comprises a metal with a p-type work function. In some embodiments, the select gate electrode comprises a metal with an n-type work function.


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