The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
May. 07, 2020
Applicant:
Cree, Inc., Durham, NC (US);
Inventors:
Mitch Flowers, Durham, NC (US);
Erwin Cohen, Durham, NC (US);
Alexander Komposch, Morgan Hill, CA (US);
Assignee:
WOLFSPEED, INC., Durham, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 23/3107 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/8384 (2013.01);
Abstract
A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.