The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Jun. 04, 2019
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Mi Seon Yoon, Daejeon, KR;
Sera Kim, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Bora Yeon, Daejeon, KR;
Sang Hwan Kim, Daejeon, KR;
Eun Yeong Kim, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/304 (2006.01); C09J 7/29 (2018.01); B32B 27/36 (2006.01); B32B 7/14 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 7/29 (2018.01); H01L 21/304 (2013.01); C09J 2433/00 (2013.01); C09J 2475/00 (2013.01); H01L 2221/68327 (2013.01);
Abstract
The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of −30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.