The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Feb. 21, 2018
Mitsubishi Materials Corporation, Tokyo, JP;
Keiichiro Oishi, Osaka, JP;
Kouichi Suzaki, Osaka, JP;
Hiroki Goto, Osaka, JP;
Shinji Tanaka, Osaka, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 75.0≤f1=Cu+0.8×Si−7.5×Sn+P+0.5×Pb≤78.2; 60.0≤f2=Cu−4.8×Si−0.8×Sn−P+0.5×Pb≤61.5; and 0.09≤f3=P/Sn≤0.30. The area percentage (%) of respective constituent phases satisfies the following relations: 30≤κ≤65; 0≤γ≤2.0; 0≤β≤0.3; 0≤μ≤2.0; 96.5≤f4=α+κ; 99.4≤f5=α+κ+γ+μ; 0≤f6=γ+μ≤3.0; and 35≤f7=1.05×κ+6×γ+0.5×μ≤70. κ phase is present in α phase, the long side of the γ phase is at most 50 μm, and the long side of the μ phase is at most 25 μm.