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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11418002 B1

PDFFull Text
Date of Patent:
Aug. 16, 2022

Filed:

Oct. 31, 2019

Electronic package and method for fabricating the same

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Kong-Toon Ng, Taichung, TW;

Yi-Chian Liao, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorney:

Hsuanyeh Law Group PC

Primary Examiner:

Luan C Thai

Int. Cl.
CPC ...
G01N 21/17 (2006.01); H01S 5/02234 (2021.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01S 5/02355 (2021.01); H04B 10/50 (2013.01);
U.S. Cl.
CPC ...
H01S 5/02234 (2021.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01S 5/02355 (2021.01); H01L 2221/68372 (2013.01); H01L 2224/214 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1426 (2013.01); H04B 10/503 (2013.01);
Abstract

An electronic package and a method for fabricating an electronic package are provided. An encapsulation layer encapsulates a first electronic component and a plurality of conductive pillars, and is defined with a reservation region and a removal region adjacent to the reservation region. A circuit structure is disposed on the encapsulation layer. The removal region and the circuit structure therewithin are removed for an optical communication element to protrude from a lateral surface of the encapsulation layer when the optical communication element is disposed on the circuit structure, so as to avoid a packaging material used in a subsequent process from being adhered to a protruding portion of the optical communication element.

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