The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
Aug. 10, 2018
Applicant:
Tdk Electronics Ag, Munich, DE;
Inventors:
Thomas Feichtinger, Graz, AT;
Franz Rinner, Frauental, AT;
Werner Rollett, St Martin im Sulmtal, AT;
Assignee:
TDK ELECTRONICS AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/34 (2006.01); H01L 23/60 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2006.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3731 (2013.01); H01L 23/15 (2013.01); H01L 23/34 (2013.01); H01L 23/3735 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/60 (2013.01); H01L 25/075 (2013.01); H01L 25/167 (2013.01); H01L 33/642 (2013.01); H05K 1/0206 (2013.01); H05K 1/0207 (2013.01); H05K 1/0306 (2013.01); H05K 1/189 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10151 (2013.01);
Abstract
An LED module is disclosed. In an embodiment an LED module includes a thermally conductive substrate made of a multilayer ceramic, at least one LED on the substrate, passive SMD components arranged on the substrate, a passive component integrated in the substrate and a heat spreader configured to dissipate waste heat in horizontal and vertical directions.