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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11417558 B1

PDFFull Text
Date of Patent:
Aug. 16, 2022

Filed:

Apr. 15, 2021

Ceramics substrate, method of manufacturing the same, electrostatic chuck, substrate fixing device, and semiconductor device package

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Tomotake Minemura, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Sherman Ng

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/683 (2006.01); H01L 23/13 (2006.01); H01L 23/15 (2006.01); H01L 21/48 (2006.01); H01L 21/67 (2006.01); H01L 23/367 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 23/49866 (2013.01); H01J 37/32715 (2013.01); H01J 2237/2007 (2013.01); H01L 21/67069 (2013.01); H01L 23/367 (2013.01);
Abstract

A ceramics substrate includes: a substrate body; an electric conductor layer that is built in the substrate body; and a via that is built in the substrate body to be electrically connected to the electric conductor layer. The substrate body is made of ceramics containing aluminum oxide. The via is made of a fired body of an electric conductor paste. The electric conductor paste contains molybdenum as a main component and further contains nickel oxide, aluminum oxide, and silicon dioxide.

Find Patent Forward Citations

Minemura, Tomotake. (2022). Ceramics substrate, method of manufacturing the same, electrostatic chuck, substrate fixing device, and semiconductor device package (U.S. Patent No. 11417558). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11417558

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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