The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Apr. 26, 2018
Applicant:

South China University of Technology, Guangzhou, CN;

Inventors:

Wenliang Wang, Guangzhou, CN;

Guoqiang Li, Guangzhou, CN;

Yulin Zheng, Guangzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 31/18 (2006.01); H01L 29/778 (2006.01); C23C 16/02 (2006.01); C23C 16/30 (2006.01); C30B 25/18 (2006.01); C30B 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0254 (2013.01); C23C 16/0227 (2013.01); C23C 16/303 (2013.01); C30B 25/186 (2013.01); C30B 29/403 (2013.01); H01L 21/02052 (2013.01); H01L 21/0262 (2013.01); H01L 21/02433 (2013.01); H01L 21/02444 (2013.01); H01L 21/02609 (2013.01); H01L 21/0242 (2013.01); H01L 21/02381 (2013.01);
Abstract

The present invention discloses a two-dimensional AlN material and its preparation method and application, wherein the preparation method comprises the following steps: (1) selecting a substrate and its crystal orientation; (2) cleaning the surface of the substrate; (3) transferring a graphene layer to the substrate layer; (4) annealing the substrate; (5) using the MOCVD process to introduce Hto open the graphene layer and passivate the surface of the substrate; and (6) using the MOCVD process to grow a two-dimensional AlN layer. The preparation method of the present invention has the advantages that the process is simple, time saving and efficient. Besides, the two-dimensional AlN material prepared by the present invention can be widely used in HEMT devices, deep ultraviolet detectors or deep ultraviolet LEDs, and other fields.


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