The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Dec. 30, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Gerrit J. Vreman, Shingle Springs, CA (US);
Mohamed A. Abdelmoneum, Portland, OR (US);
Satoshi Suzuki, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/047 (2006.01); H01L 41/09 (2006.01); H01L 41/053 (2006.01); B06B 1/06 (2006.01); H01L 41/18 (2006.01); H01L 41/25 (2013.01); H01L 41/338 (2013.01);
U.S. Cl.
CPC ...
H01L 41/0474 (2013.01); B06B 1/0644 (2013.01); H01L 41/0533 (2013.01); H01L 41/09 (2013.01); H01L 41/18 (2013.01); H01L 41/25 (2013.01); H01L 41/338 (2013.01);
Abstract
Aspects of the embodiments are directed to systems and devices that include a piezo-electric element comprising a top-side electrode and a bottom-side electrode; a metal contact pad electrically connected to the bottom-side electrode; an electrode electrically connected to the top-side electrode; and an encasement encasing the piezo-electric element. The piezo-electric element can be prepared to include steps and metallization for use in one or more types of packaging.