The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Mar. 17, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Kaochao Chen, Hsin-Chu, TW;

Chia-Cheng Ho, Hsinchu, TW;

Ming Chyi Liu, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/40 (2006.01); H01L 21/3105 (2006.01); H01L 21/768 (2006.01); H01L 29/06 (2006.01); H01L 29/16 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/402 (2013.01); H01L 21/31053 (2013.01); H01L 21/76829 (2013.01); H01L 29/0653 (2013.01); H01L 29/1608 (2013.01); H01L 29/7816 (2013.01);
Abstract

An integrated chip includes a field plate overlying an isolation structure. A gate electrode overlies a substrate between a source region and a drain region. An etch stop layer laterally extends from an upper surface of the gate electrode to a front-side of the substrate. The etch stop layer overlies a drift region disposed between the source region and the drain region. The field plate is disposed within a first inter-level dielectric (ILD) layer overlying the substrate. The field plate extends from a top surface of the first ILD layer to an upper surface of the etch stop layer. The isolation structure is disposed within the substrate and extends from the front-side of the substrate to a point below the front-side of the substrate. The isolation structure is disposed laterally between the gate electrode and the drain region.


Find Patent Forward Citations

Loading…