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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11411073 B1

PDFFull Text
Date of Patent:
Aug. 09, 2022

Filed:

Feb. 26, 2020

Semiconductor package device and method for manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Shao Hsuan Chuang, Kaohsiung, TW;

Huang-Hsien Chang, Kaohsiung, TW;

Min Lung Huang, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Benjamin P Sandvik

Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 49/02 (2006.01); H01L 21/48 (2006.01); H01L 29/94 (2006.01); H01L 27/108 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 28/88 (2013.01); H01L 28/60 (2013.01); H01L 28/92 (2013.01); H01L 21/4814 (2013.01); H01L 23/3178 (2013.01); H01L 27/10829 (2013.01); H01L 27/10861 (2013.01); H01L 29/945 (2013.01);
Abstract

A semiconductor package device includes a first conductive wall, a second conductive wall, a first insulation wall, a dielectric layer, a first electrode, and a second electrode. The first insulation wall is disposed between the first and second conductive walls. The dielectric layer has a first portion covering a bottom surface of the first conductive wall, a bottom surface of the second conductive wall and a bottom surface of the first insulation wall. The first electrode is electrically connected to the first conductive wall. The second electrode is electrically connected to the second conductive wall.

Find Patent Forward Citations

Chuang, Shao. (2022). Semiconductor package device and method for manufacturing the same (U.S. Patent No. 11411073). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11411073

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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