The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Oct. 21, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chung-Chieh Yang, Zhubei, TW;

Chung-Ting Lu, Kaohsiung, TW;

Yung-Chow Peng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 21/768 (2006.01); H01L 21/8238 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); H01L 21/76885 (2013.01); H01L 21/823871 (2013.01); H01L 23/5226 (2013.01);
Abstract

A semiconductor device includes an electrical circuit having a first set of circuit elements, wherein the electrical circuit is in a circuit area on a first side of a substrate, and a first set of conductive pillars over the first side of the substrate. In the semiconductor device, a first conductive rail electrically connects to each of the first set of conductive pillars, wherein each of the first set of conductive pillars is electrically connected to each of the first set of circuit elements by the first conductive rail; and a first power cell extending through the substrate, wherein the first power cell includes a first number of power pillars extending through the substrate, wherein each of the first number of power pillars electrically connects to the first conductive rail in parallel.


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