The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Jul. 22, 2020
Applicant:
Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;
Inventor:
Tetsuro Kinoshita, Kawasaki, JP;
Assignee:
Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/066 (2014.01); B23K 26/40 (2014.01); B23K 26/364 (2014.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/066 (2015.10); B23K 26/364 (2015.10); B23K 26/40 (2013.01); B23K 2101/40 (2018.08);
Abstract
A protective film forming agent for dicing of semiconductor wafers for forming a protective film on the surface of the semiconductor wafers and capable of forming a protective film of high absorbance index, and a production method of semiconductor chips using the protective film forming agent. In a protective film forming agent containing a water-soluble resin, light absorber and solvent, a compound having a specific structure is used as the light absorber. The content of the light absorber in the protective film forming agent is 0.1% by mass or more and 10% by mass or less.