The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Dec. 06, 2018
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Koya Arai, Saitama, JP;
Shuji Nishimoto, Saitama, JP;
Masahito Komasaki, Saitama, JP;
Yoshiyuki Nagatomo, Saitama, JP;
Yoshirou Kuromitsu, Saitama, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/30 (2006.01); H01L 35/08 (2006.01); H01L 35/32 (2006.01); H01L 35/34 (2006.01);
U.S. Cl.
CPC ...
H01L 35/30 (2013.01); H01L 35/08 (2013.01); H01L 35/32 (2013.01); H01L 35/34 (2013.01);
Abstract
An insulated heat transfer substrate includes a heat transfer layer formed of aluminum or an aluminum alloy, a conductive layer provided on one surface side of the heat transfer layer, and a glass layer formed between the conductive layer and the heat transfer layer, in which the conductive layer is formed of a sintered body of silver, and a thickness of the glass layer is in a range of 5 μm or larger and 50 μm or smaller.