The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Feb. 12, 2020
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
David Fraser Rae, San Diego, CA (US);
John Holmes, San Diego, CA (US);
Marcus Hsu, San Diego, CA (US);
Kuiwon Kang, San Diego, CA (US);
Avantika Sodhi, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/42 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 23/42 (2013.01); H01L 23/49822 (2013.01);
Abstract
A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spreader. The second substrate is configured to be free of an electrical connection with the integrated device.