The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11402753 B1

Date of Patent:

Aug. 02, 2022

Filed:

Aug. 23, 2018

Positive resist composition, resist film formation method, and laminate manufacturing method

Applicant:

Zeon Corporation, Chiyoda-ku Tokyo, JP;

Inventor:

Manabu Hoshino, Tokyo, JP;

Assignee:

ZEON CORPORATION, Chiyoda-ku Tokyo, JP;

Attorney:

Kenja IP Law PC

Primary Examiner:

Martin J Angebranndt

Int. Cl.

CPC ...

G03F 7/039 (2006.01); G03F 7/038 (2006.01); G03F 7/38 (2006.01); G03F 7/20 (2006.01); G03F 7/004 (2006.01);

U.S. Cl.

CPC ...

G03F 7/0046 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/20 (2013.01); G03F 7/38 (2013.01);

Abstract

Provided is a positive resist composition capable of improving the adhesion between a resist film formed through pre-baking and a workpiece and reducing changes in the molecular weight of the polymer in the resist film before and after pre-baking step over broader ranges of heating temperature and heating time (at lower heating temperatures) during pre-baking. The positive resist composition comprises a polymer and a solvent, wherein the polymer has a monomer unit (A) represented by the following general formula (I) and a monomer unit (B) represented by the following general formula (II), and wherein the solvent is at least one selected from the group consisting of isoamyl acetate, n-butyl formate, isobutyl formate, n-amyl formate, and isoamyl formate:

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