The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Feb. 20, 2019
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Takanori Inada, Tokyo, JP;

Kazumasa Hosotani, Tokyo, JP;

Kazutomo Miyazaki, Tokyo, JP;

Kohei Matsumoto, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01D 47/02 (2006.01); F23J 15/02 (2006.01); F23G 7/06 (2006.01); B01D 53/46 (2006.01); B01D 53/78 (2006.01); B01D 53/18 (2006.01); B01D 53/68 (2006.01); B01D 53/58 (2006.01);
U.S. Cl.
CPC ...
B01D 47/027 (2013.01); B01D 53/18 (2013.01); B01D 53/46 (2013.01); B01D 53/58 (2013.01); B01D 53/68 (2013.01); B01D 53/78 (2013.01); F23G 7/06 (2013.01); F23J 15/02 (2013.01); F23J 15/025 (2013.01); B01D 2257/204 (2013.01); B01D 2257/406 (2013.01); B01D 2257/553 (2013.01); F23G 2209/142 (2013.01); F23J 2217/50 (2013.01); F23J 2219/40 (2013.01);
Abstract

A wet abatement system which can suppress the accumulation of foreign matters in a treatment gas line is proposed. There is provided a wet abatement system for detoxifying treatment gas by bringing the treatment gas into contact with liquid. The wet abatement system includes an inlet casing having an inlet port from which the treatment gas is let in and an outlet port provided below the inlet port and through which the treatment gas flows, and a liquid film forming device provided between the inlet port and the outlet port and configured to form a liquid film on an inner wall surface of the inlet casing. A heater configured to heat the inlet casing is embedded in an interior of a wall portion of the inlet casing, the wall portion constituting a portion situated above the liquid film forming device.


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